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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering [[electronic resource] ] : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method / / by Seonho Seok
| Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering [[electronic resource] ] : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method / / by Seonho Seok |
| Autore | Seok Seonho |
| Edizione | [1st ed. 2018.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2018 |
| Descrizione fisica | 1 online resource (119 pages) |
| Disciplina | 658.51 |
| Collana | Springer Series in Advanced Manufacturing |
| Soggetto topico |
Manufactures
Nanotechnology Materials science Tribology Corrosion and anti-corrosives Coatings Manufacturing, Machines, Tools, Processes Nanotechnology and Microengineering Characterization and Evaluation of Materials Tribology, Corrosion and Coatings |
| ISBN | 3-319-77872-2 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Overview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies. . |
| Record Nr. | UNINA-9910299940603321 |
Seok Seonho
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| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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MEMS Packaging Technologies and 3D Integration
| MEMS Packaging Technologies and 3D Integration |
| Autore | Seok Seonho |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2022 |
| Descrizione fisica | 1 electronic resource (210 p.) |
| Soggetto topico |
Research & information: general
Biology, life sciences |
| Soggetto non controllato |
heterogeneous integration
wafer bonding wafer sealing room-temperature bonding Au-Au bonding surface activated bonding Au film thickness surface roughness microelectromechanical systems (MEMS) packaging inkjet printing redistribution layers capacitive micromachined ultrasound transducers (CMUT) fan-out wafer-level packaging (FOWLP) adhesion thin film metal parylene neural probe scotch tape test FEM MEMS resonator temperature coefficient thermal stress millimeter-wave redundant TSV equivalent circuit model S-parameters extraction technology evaluation MEMS and IC integration MCDM fuzzy AHP fuzzy VIKOR fan-out wafer-level package finite element glass substrate reliability life packaging-on-packaging thermal sensors TMOS sensor finite difference time domain optical and electromagnetics simulations finite element analysis ultrasonic bonding metal direct bonding microsystem integration biocompatible packaging implantable reliability Finite element method (FEM) simulation multilayer reactive bonding integrated nanostructure-multilayer reactive system spontaneous self-ignition self-propagating exothermic reaction Pd/Al reactive multilayer system Ni/Al reactive multilayer system low-temperature MEMS packaging crack propagation microbump deflection angle stress intensity factor (SIF) polymer packaging neural interface chronic implantation |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910576876203321 |
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Seok Seonho
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| MDPI - Multidisciplinary Digital Publishing Institute, 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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